After chemical mechanical polishing (CMP), inorganic, organic, and chemical residues remain on the wafer surface, which can cause defects if not removed. PVA brush rollers provide a gentle, scratch-free cleaning solution while maintaining their flexible structure even after absorbing liquids. The brush delivers cleaning chemicals and deionized water to the wafer surface, rolling and scrubbing to achieve effective, continuous cleaning and drying.

Features

• Air-foaming technology: No starch residues.

• Industry-leading detection capabilities: Can detect minimal metal and liquid particles.

• Energy efficient: Reduces CMP water usage by 10% and lowers energy consumption in wastewater treatment.

• Enhanced utilization: Significantly reduces pre-cleaning break-in time and minimizes dummy wafer usage.

• One-piece design: Molded PVA foam integrated with the core reduces the risk of distortion.

• Excellent liquid transmissibility and self-cleaning ability: 100% interconnected pore structure for superior cleaning performance.

• Customizable: Adjustable water flow for optimized cleaning.